发明名称 ELECTROSTATIC CHUCK DEVICE
摘要 An electrostatic chuck device includes a base plate, an electrostatic chuck plate coupled to an upper surface of the base plate and including a mount region on which an attraction subject is mounted, an electrostatic electrode embedded in the chuck plate, a focus ring that is located on the upper surface of the base plate and covers an outer side surface and a portion of an upper surface of the chuck plate. A groove is located in the upper surface of the chuck plate at a portion that corresponds to a region between the focus ring and the mount region in a plan view. The groove is filled with a protective layer. The groove is located at a position separated from the electrostatic electrode in a plan view. The protective layer is formed from a material having a higher plasma resistance than a material forming the chuck plate.
申请公布号 US2017069519(A1) 申请公布日期 2017.03.09
申请号 US201615248774 申请日期 2016.08.26
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 SHIRAIWA NORIO
分类号 H01L21/683 主分类号 H01L21/683
代理机构 代理人
主权项 1. An electrostatic chuck device comprising: a base plate; an electrostatic chuck plate coupled to an upper surface of the base plate and including a mount region on which an attraction subject is mounted; an electrostatic electrode embedded in the electrostatic chuck plate; a focus ring located on the upper surface of the base plate, wherein the focus ring covers an outer side surface of the electrostatic chuck plate and a portion of an upper surface of the electrostatic chuck plate; a groove located in the upper surface of the electrostatic chuck plate at a portion that corresponds to a region between the focus ring and the mount region in a plan view; and a protective layer with which the groove is filled, wherein the groove is located at a position separated from the electrostatic electrode in a plan view, and the protective layer is formed from a material having a higher plasma resistance than a material forming the electrostatic chuck plate.
地址 NAGANO-SHI JP