CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

A curable organopolysiloxane composition and a semiconductor device are described. In a cured state and under conditions that the temperature is 25° C. and the humidity is 60% RH, the composition has the tensile strength of 2 to 8 Mpa, the elongation at break of 35% to 100% and the index of refraction being equal to or greater than 1.45. The composition includes: (A) organopolysiloxane comprising an R13SiO1/2 unit, an R22SiO2/2 unit and an R3SiO3/2 unit; (B) branched polyorganohydrogensiloxane having the viscosity of 300 to 4000 mPa·s, wherein each molecule has on average at least three silicon-bonded hydrogen atoms and at least one aromatic group, and the content of the aromatic group is larger than 10 mol %; and (C) a hydrosilylation catalyst having the content capable of facilitating curing of the composition.

主权项

1. A curable organopolysiloxane composition, wherein, in its cured state and under conditions that the temperature is 25° C. and the humidity is 60% RH, the composition has a tensile strength of 2 to 8 Mpa, an elongation at break of 35% to 100%, and an index of refraction being equal to or greater than 1.45, the composition comprises:
(A) organopolysiloxane comprising an R13SiO1/2 unit, an R22SiO2/2 unit and an R3SiO3/2 unit, wherein R1 is selected from similar or different alkenyl groups, univalent substituted or unsubstituted hydrocarbonyls which do not contain any aromatic hydrocarbon and aliphatic unsaturated bond, R2 is selected from similar or different alkenyl groups, aromatic groups, univalent substituted or unsubstituted hydrocarbonyls which do not contain any aromatic hydrocarbon and aliphatic unsaturated bond, and R3 is an aromatic group; wherein the content of the aromatic group is larger than 10 mol % and the content of alkenyl groups is larger than 0.1 mol/100 g; (B) branched polyorganohydrogensiloxane having the viscosity of 300 to 4000 mPa·s, wherein each molecule has on average at least three silicon-bonded hydrogen atoms and at least one aromatic group, and the content of the aromatic group is larger than 10 mol %; (C) a hydrosilylation catalyst having the content capable of facilitating curing of the composition.