PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM

摘要

The present invention relates to a plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous acidic plating bath according to the present invention comprises a source for palladium ions, a reducing agent, a nitrogenated complexing agent for palladium ions and a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect. The plating bath has an increased stability against undesired decomposition while maintaining a sufficient plating rate.

主权项

1. An aqueous acidic plating bath composition for electroless deposition of palladium, comprising
(i) a source for palladium ions, (ii) a nitrogenated complexing agent for palladium ions, (iii) a reducing agent selected from the group consisting of formic acid, derivatives and salts thereof, (iv) a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect, and
wherein the at least one hydrophilic residue is selected from the group consisting of hydroxyl, carboxyl, sulfonate and salts thereof; andwherein the at least one residue having a negative mesomeric effect is selected from the group consisting of nitro, nitrile, acetyl, carboxyl and sulfonate.