| 发明名称 |
Edge Interconnect Self-Assembly Substrate |
| 摘要 |
A substrate assembly includes a first microchip including a first interconnecting structure and a second microchip including a second interconnecting structure, wherein the first and second interconnecting structures have keyed complementary, interlocking shapes. The first interconnecting structure is interlocked with the second interconnecting structure. Quilt package nodules on edges of the first and second microchips electrically connect circuitry formed on or supported by the first and second microchips. |
| 申请公布号 |
US2017125389(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201615333325 |
申请日期 |
2016.10.25 |
| 申请人 |
Indiana Integrated Circuits, LLC |
发明人 |
Kulick Jason M.;Lu Tian |
| 分类号 |
H01L25/10;H01L25/00 |
主分类号 |
H01L25/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate assembly comprising:
a first microchip including a first interconnecting structure; and a second microchip including a second interconnecting structure, wherein the first and second interconnecting structures have complementary, interlocking shapes; wherein the first interconnecting structure is interlocked with the second interconnecting structure. |
| 地址 |
South Bend IN US |
