| 发明名称 |
CHIP RESISTOR AND METHOD OF PRODUCING THE SAME |
| 摘要 |
A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape. |
| 申请公布号 |
US2017125143(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201615352263 |
申请日期 |
2016.11.15 |
| 申请人 |
ROHM CO., LTD. |
发明人 |
NUKAGA Eiji;TAMAGAWA Hiroshi;KONDO Yasuhiro;MATSUURA Katsuya |
| 分类号 |
H01C17/00;H01C7/00;H01G4/38;H01G4/40;H01C13/02;H01L29/66;H01L29/861;H01L23/525;H01L23/528;H01L21/78;H01L21/3065;H01C17/08;H01F27/40 |
主分类号 |
H01C17/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip component production method, comprising:
forming a device in each of a plurality of chip component regions defined on a front surface of a substrate; forming a trench in a boundary region defined between the chip component regions, the trench having a predetermined depth as measured from the front surface of the substrate; and grinding a back surface of the substrate to the trench to divide the substrate into a plurality of chip components. |
| 地址 |
Kyoto JP |
