METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

A method for manufacturing a circuit board is provided, including providing a substrate. A first inkjet printing step is performed to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction. The microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction. Also, a second inkjet printing step is performed to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets.

主权项

1. A method for manufacturing a circuit board, comprising:
providing a substrate; performing a first inkjet printing step to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction, wherein the microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction; and performing a second inkjet printing step to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets.