发明名称 PLASMA DRY ETCHING METHOD
摘要 PURPOSE:To perform uniform etching having superior reproducibility by forming a ground electrode so that it has an area larger than that of a feeder electrode, specifying gas pressure in a chamber, and then inducing plasma discharge to stabilize the plasma discharge. CONSTITUTION:A ground electrode 3 having a larger area than a feeder electrode 2 is disposed in a manner to be opposed to the feeder electrode 2, and then plasma discharge is induced. This plasma is confined by means of insulating walls 1. Subsequently, a high-frequency voltage is impressed on both electrodes 2, 3 mentioned above from a capacity load 4 connected to the above feeder electrode 2 and a high-frequency electric power source 5. At this time, a specimen 6 is etched while regulating gas pressure to 0.1-5Torr.
申请公布号 JPH01246375(A) 申请公布日期 1989.10.02
申请号 JP19880074010 申请日期 1988.03.28
申请人 SANYO ELECTRIC CO LTD 发明人 NAKAYAMA SHOICHIRO
分类号 B01J19/08;C23F4/00 主分类号 B01J19/08
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