Heat dissipation approach in chip on board assembly by using stacked copper microvias

摘要

The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.

主权项

1. An optical transceiver comprising:
an optical transmitter comprising a first chip-on-board package coupled to a printed circuit board (PCB) and an optical receiver comprising a second chip-on-board package coupled to the PCB, the optical transmitter and the optical receiver positioned above a plurality of thermal microvias configured to draw thermal energy away from the optical transmitter and the optical receiver, wherein the plurality of thermal microvias are coupled with at least one of a heat spreader and a heat sink; the optical transmitter comprising a light source electrically coupled with a driver circuit; and the optical receiver comprising a light detector electrically coupled with a receiver circuit.