Method for manufacturing electronic devices

摘要

An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.

主权项

1. A method, comprising:
attaching a conductive ribbon to a first conductive pad that is disposed over a substrate; forming a layer of packaging material over the ribbon; removing a portion of the layer to form a first surface of the layer and a second surface of the layer that is approximately orthogonal to the first surface of the layer, the removing the portion of the layer exposing a first contact surface of the ribbon that is approximately coplanar with the first surface of the layer and exposing a second exposed contact surface of the ribbon that is approximately coplanar with the second surface of the layer to form a contact region including the first and second contact surfaces; wherein attaching the conductive ribbon includes:
attaching a first end of the conductive ribbon to the first pad;attaching a second end of the conductive ribbon to a second conductive pad that is disposed over the substrate and such that a midsection of the ribbon is farther from the substrate than the first and second ends; wherein removing the portion of the layer includes removing the portion of the layer to expose the midsection of the ribbon; removing a portion of the midsection to form the contact region; cutting through the midsection of the ribbon, the layer of packaging material, and the substrate to form an integrated circuit; forming a cavity through the contact region; and forming a conductive T-shaped filler structure in the cavity, the T-shaped filler structure including a vertical portion extending within the cavity and horizontal portions extending on the contact region.