Metalized microphone lid with integrated wire bonding shelf

摘要

A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

主权项

1. A microelectricalmechanical (MEMS) microphone package comprising:
a substrate cap having an interior and exterior surface; a molded lid having an interior surface, an exterior surface, and side walls, the lid attached to the substrate cap such that the substrate cap and the lid form a cavity in the MEMS microphone package; an acoustic porthole in the lid; a MEMS microphone die positioned proximal to the porthole; a bonding shelf located within the cavity, located at a raised position relative to the lid, and being a molded structure; and a first electrical trace deposited on the bonding shelf including a first end and a second end, the first end connected to a bonding wire located within the cavity, the second end connected to a contact pad on the interior surface of the substrate cap.