Cavity-down pressure sensor device

摘要

A cavity-down pressure sensor device has a pressure-sensing die that is electrically connected to a master control unit (MCU) using face-to-face bonding. Connecting the pressure-sensing die in this manner avoids the need to wire bond the pressure-sensing die to the master control unit.

主权项

1. A sensor device, comprising:
a lead frame having a die paddle; a master control unit (MCU) attached to the die paddle of the lead frame; a P-cell mounted on an active side of the MCU, wherein the P-cell has a pressure-sensing active region facing and electrically connected to the active side of the MCU; a substrate having a central opening attached to the lead frame, wherein the central opening forms a cavity, the die paddle is exposed through the central opening, and the MCU and the P-cell are located within the cavity; a pressure-sensitive gel covering the active region of the P-cell; bond wires electrically connecting the MCU to the substrate; and conductive balls attached to the substrate, wherein the conductive balls are electrically connected to the MCU by way of conductive traces in the substrate and the bond wires.