| 发明名称 | Integrated fan-out (InFO) package structures and methods of forming same | ||
| 摘要 | An embodiment method includes providing a carrier having a recess and attaching a die to the carrier, wherein the die is at least partially disposed in the recess. The method further includes forming a molding compound over the carrier and around at least a portion of the die, forming fan-out redistribution layers over the molding compound and electrically connected to the die, and removing the carrier. | ||
| 申请公布号 | US9640498(B1) | 申请公布日期 | 2017.05.02 |
| 申请号 | US201514918256 | 申请日期 | 2015.10.20 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Huang Chang-Pin;Yu Chen-Hua;Yang Ching-Jung;Liu Chung-Shi;Tu Hsien-Ming;Kuo Hung-Yi;Tsai Hao-Yi;Liang Shih-Wei;Lai Yu-Chia |
| 分类号 | H01L23/48;H01L23/52;H01L23/00;H01L23/31;H01L23/29;H01L21/56 | 主分类号 | H01L23/48 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A method comprising: providing a carrier comprising a recess; attaching a die to the carrier, wherein the die is partially disposed in the recess and extends higher than the recess; forming a molding compound over the carrier and around at least a portion of the die; forming fan-out redistribution layers (RDLs) over the molding compound and electrically connected to the die; and removing the carrier. | ||
| 地址 | Hsin-Chu TW | ||