Printed circuit board assemblies and a wellbore system

摘要

Printed circuit board assemblies having capabilities for operating under high ampacity conditions are sometimes difficult to fabricate and lack sufficient mechanical robustness for extreme operating environments. Accordingly, printed circuit board assemblies comprise: a non-conductive substrate having a plurality of planar conductive pathways disposed thereon; an electronic component that is in electrical communication with one or more of the planar conductive pathways and is configured to supply an electrical current thereto; a superficial metallic conductor overlaying one or more of the planar conductive pathways, at least in part, the superficial metallic conductor having an electrical connection to the electronic component and also being in electrical communication with the planar conductive pathways; and a conductive element in electrical communication with the superficial metallic conductor, the conductive element being configured to withdraw electrical current from the printed circuit board assembly.

主权项

1. A printed circuit board assembly comprising:
a non-conductive substrate having a plurality of planar conductive pathways disposed thereon; an electronic component that is in electrical communication with one or more of the planar conductive pathways and is configured to supply an electrical current thereto; a superficial metallic conductor overlaying one or more of the planar conductive pathways, at least in part, the superficial metallic conductor being electrically connected to the electronic component via one or more leads attached to the superficial metallic conductor and the electronic component; and wherein the superficial metallic conductor is also in electrical communication with the planar conductive pathways; a current-withdrawing conductive element in electrical communication with the superficial metallic conductor, and
wherein the current-withdrawing conductive element comprises a bus bar elevated above a surface of the non-conductive substrate by an electrically conductive standoff that establishes electrical communication between the superficial metallic conductor and the bus bar.