Label for in-mold forming

摘要

A label for in-mold forming comprising a thermoplastic resin film with a heat-sealable layer, a printable thermoplastic resin film, and an antenna and an IC chip. The antenna and the IC chip are interposed between the thermoplastic resin films. The label is strong and water resistant with a high adhesive strength. The label has the function of an IC label and has a printable surface. Also provided is a thermoplastic resin container bearing the label. Bonding the label to a thermoplastic resin container does not damage the IC chip and antenna.

主权项

1. A label for in-mold forming, comprising:
a first thermoplastic resin film having a heat-sealable layer; a second thermoplastic resin film that is printable; an adhesive layer comprising at least one adhesive selected from the group consisting of an ultraviolet-curing adhesive and an electron-beam-curing adhesive; and an antenna and an IC chip for data sending/receiving, the antenna and the IC chip being interposed between the first thermoplastic resin film and the second thermoplastic resin film, wherein the adhesive layer is formed between the first thermoplastic resin film and the second thermoplastic resin film, wherein the adhesive layer obtains adhesiveness that bonds the first thermoplastic resin film and the second thermoplastic resin film together, by curing the at least one adhesive selected from the group consisting of the ultraviolet-curing adhesive and the electron-beam-curing adhesive in the adhesive layer with ultraviolet light or with an electron beam, respectively, while the adhesive layer contacts the first thermoplastic resin film and the second thermoplastic resin film, wherein the first thermoplastic resin film has a film layer having voids therein, porosity of the first thermoplastic resin film as determined using a following equation is 1-60%, and the thermal conductivity of the first thermoplastic resin film is 0.05 to 0.15 W/m·K: Porosity (%)=[(ρ0−φ/ρ0]×100, wherein ρ0 is a true density of the first thermoplastic resin film, and ρ is a density of the first thermoplastic resin film, and wherein the heat-sealable layer comprises a heat-sealable resin comprising an ethylene resin having a melting point of 50-130° C.