| 发明名称 | Mixed alloy solder paste | ||
| 摘要 | A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux. | ||
| 申请公布号 | US9636784(B2) | 申请公布日期 | 2017.05.02 |
| 申请号 | US201514643868 | 申请日期 | 2015.03.10 |
| 申请人 | Indium Corporation | 发明人 | Zhang Hongwen;Lee Ning-Cheng |
| 分类号 | B23K35/02;B23K35/26;B23K35/24;C22C13/00;C22C13/02;C22C12/00;C22C30/04;C22C30/02;C22C30/06;H05K3/34;B23K35/362;H01L23/00 | 主分类号 | B23K35/02 |
| 代理机构 | Sheppard Mullin Richter & Hampton LLP | 代理人 | Sheppard Mullin Richter & Hampton LLP |
| 主权项 | 1. A solder paste, consisting of: an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and flux; wherein the first solder alloy powder consists of a first solder alloy that has a solidus temperature above 260° C., wherein the first solder alloy is a Bi—Ag alloy, a Bi—Ag—Y alloy, a Bi—Cu alloy, a Bi—Cu—Y alloy, a Bi—Ag—Cu alloy, or a Bi—Ag—Cu—Y alloy, wherein Y consists of Al, Au, Co, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, Sn, or Zn; and wherein the second solder alloy powder consists of a second solder alloy that has a solidus temperature that is less than 250° C. | ||
| 地址 | Clinton NY US | ||