Semiconductor device including a solder barrier

摘要

A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip.

主权项

1. A semiconductor device comprising:
a leadframe; a semiconductor chip comprising a contact, the contact facing the leadframe and electrically coupled to a surface of the leadframe via solder; and a solder barrier adjacent to the contact and an edge of the semiconductor chip, the solder barrier disposed above the surface of the leadframe and at least partially between the semiconductor chip and the surface of the leadframe to prevent the solder from reaching the edge of the semiconductor chip during a solder reflow process.