| 发明名称 |
CLIP AND RELATED METHODS |
| 摘要 |
A clip for a semiconductor package. Implementations may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure. |
| 申请公布号 |
US2017117211(A1) |
申请公布日期 |
2017.04.27 |
| 申请号 |
US201615094022 |
申请日期 |
2016.04.08 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
CHEW Chee Hiong;PRAJUCKAMOL Atapol;YAO Yushuang |
| 分类号 |
H01L23/495;H01L29/739;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A clip for a semiconductor package comprising:
an electronically conductive clip having a first end and a second end and a middle section between the first end and the second end; wherein the first end is configured to couple to a first die through a bonding material; wherein the second end is configured to couple to a second die through a bonding material; wherein the middle section is configured to couple to an emitter structure through a bonding material; wherein the clip comprises an integrally formed electrically conductive material and comprises an M-shape; and wherein a middle of the M-shape is coupled to the emitter structure. |
| 地址 |
Phoenix AZ US |
