| 发明名称 |
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME |
| 摘要 |
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including forming a first die package, the first die package including a first die, a first electrical connector, and a first redistribution layer, the first redistribution layer being coupled to the first die and the first electrical connector, forming an underfill over the first die package, patterning the underfill to have an opening to expose a portion of the first electrical connector, and bonding a second die package to the first die package with a bonding structure, the bonding structure being coupled to the first electrical connector in the opening of the underfill. |
| 申请公布号 |
US2017117261(A1) |
申请公布日期 |
2017.04.27 |
| 申请号 |
US201715401930 |
申请日期 |
2017.01.09 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Lin Jing-Cheng;Tsai Po-Hao |
| 分类号 |
H01L25/10;H01L21/48;H01L21/683;H01L25/00;H01L23/538;H01L23/00;H01L23/31;H01L25/065;H01L21/56;H01L21/78 |
主分类号 |
H01L25/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a first package comprising:
a first die;an encapsulant surrounding the first die; anda through package via extending through the encapsulant; a second package comprising a second die, the second package being bonded to the first package by a first set of connectors; and an underfill between the first package and the second package and surrounding the first set of connectors, the underfill being non-filleted. |
| 地址 |
Hsin-Chu TW |
