Integrated device comprising flexible connector between integrated circuit (IC) packages

摘要

Some features pertain to an integrated device that includes a first integrated circuit (IC) package, a flexible connector and a second integrated circuit (IC) package. The first integrated circuit (IC) package includes a first die, a plurality of first interconnects, and a first dielectric layer encapsulating the first die. The flexible connector is coupled to the first integrated circuit (IC) package. The flexible connector includes the first dielectric layer, and an interconnect. The second integrated circuit (IC) package is coupled to the flexible connector. The second integrated circuit (IC) package includes the first dielectric layer, and a plurality of second interconnects. The first integrated circuit (IC) package, the second integrated circuit (IC) package, and the flexible connector are coupled together through at least a portion (e.g., contiguous portion) of the first dielectric layer. In some implementations, the flexible connector comprises a dummy metal layer.

主权项

1. An integrated device comprising:
a first integrated circuit (IC) package comprising:
a first die;a plurality of first interconnects; anda first dielectric layer encapsulating the first die; a flexible connector coupled to the first integrated circuit (IC) package, wherein the flexible connector comprises:
the first dielectric layer;a dummy metal layer; andan interconnect; and a second integrated circuit (IC) package coupled to the flexible connector, wherein the second integrated circuit (IC) package comprises:
the first dielectric layer; anda plurality of second interconnects, wherein the first integrated circuit (IC) package, the second integrated circuit (IC) package, and the flexible connector are coupled together through at least a portion of the first dielectric layer.