| 发明名称 | Performance enhancement of coating packaged ESC for semiconductor apparatus | ||
| 摘要 | An advanced coating for electrostatic chuck used in plasma processing chamber is provided. The advanced coating is formed using plasma enhanced physical vapor deposition. The coating is generally of Y2O3/Al2O3, although other material combinations can be used. Also, a multi-layered coating can be formed, such that an intermediate coating layer can be formed using standard plasma spray, and a top coating can be formed using PEPVD. The entire ESC assembly can be “packaged” by the coating. | ||
| 申请公布号 | US9633884(B2) | 申请公布日期 | 2017.04.25 |
| 申请号 | US201314065260 | 申请日期 | 2013.10.28 |
| 申请人 | ADVANCED MICRO-FABRICATION EQUIPMENT INC, SHANGHAI | 发明人 | He Xiaoming;Ni Tuqiang |
| 分类号 | H01T23/00;H01L21/683;C23C16/30;C23C16/40 | 主分类号 | H01T23/00 |
| 代理机构 | Womble Carlyle Sandridge & Rice LLP | 代理人 | Womble Carlyle Sandridge & Rice LLP ;Bach, Esq. Joseph |
| 主权项 | 1. An electrostatic chuck (ESC) assembly for a plasma processing chamber, comprising: a base plate; a dielectric layer over the base plate; an electrode over the dielectric layer; and, an advanced coating consisting of a mixture of Y2O3/Al2O3 or YF3/Al2O3 and covering the ESC assembly except for rear surface of the base plate. | ||
| 地址 | Shanghai CN | ||