Methods of providing dielectric to conductor adhesion in package structures

摘要

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a CVD dielectric material on a package dielectric material, and then forming a conductive material on the CVD dielectric material.

主权项

1. A method of forming a package structure comprising:
forming a first CVD dielectric material on a first dielectric material; forming openings in the first CVD dielectric material; forming openings in the first dielectric material; forming conductive material in the openings and over at least a portion of a top surface of the first CVD dielectric; and depositing a second CVD dielectric material over the conductive material, wherein the second CVD dielectric material contacts a sidewall surface and a top surface of the conductive material, and wherein at least a portion of the conductive material remains in contact with the top surface of the first CVD dielectric.