Semiconductor chip stacking assemblies

摘要

Embodiments of the invention provide semiconductor chip stacking assemblies that provide direct attachment of a first semiconductor device with a second semiconductor device. An assembly comprises a first semiconductor chip that has a first and a second set of electrical interconnect regions disposed on its surface and a second semiconductor chip. The first set of electrical interconnect regions are electrically connected with the electrical interconnect regions of a second semiconductor chip, and the second set of electrical interconnect regions are electrically interconnected with the substrate. Direct electrical connections are for example, silicon photonics device-to-driver or device-to-signal converters, logic-to-memory, memory-to-memory, and logic-to-logic chip interconnections.

主权项

1. A computing device comprising:
a mainboard; a processor mounted on the mainboard; and a chip assembly mounted on the mainboard and electrically interconnected through the mainboard with the processor, wherein the chip assembly comprises:
a first chip having a surface with a region that extends beyond an edge of the mainboard, wherein the surface has a first and a second set of electrical interconnect regions disposed on the surface,a second chip having a surface, wherein the surface has electrical interconnect regions disposed thereon, wherein the first set of electrical interconnect regions of the first chip is electrically connected to the electrical interconnect regions of the second chip, and wherein the second set of electrical interconnect regions of the first chip is electrically connected to electrical connections of the mainboard; andan alignment unit disposed adjacent to the edge of the mainboard, wherein at least a part of the alignment unit is to contact the region of the first chip surface that extends beyond the edge of the mainboard.