Semiconductor device including leadframe with a combination of leads and lands and method

摘要

A semiconductor device includes a die pad, a plurality of first lands each having a first land first top recessed portion disposed on a first land first end distal to the die pad, and a plurality of second lands each having a second land first bottom recessed portion disposed on a second land first end distal to the die pad. A semiconductor die is electrically connected to the first and second lands. A package body, which defines a bottom surface and a side surface, at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in and substantially flush with the bottom surface of the package body.

主权项

1. A semiconductor device, comprising:
a die pad; a plurality of first lands in spaced relation to the die pad, wherein each of the first lands has a first land first top recessed portion disposed on a first land first end distal to the die pad, and wherein each of the first lands has a first land second top recessed portion disposed on a first land second end proximate to the die pad; a plurality of second lands in spaced relation to the die pad, wherein each of the second lands has a second land first bottom recessed portion disposed on a second land first end distal to the die pad; a semiconductor die electrically coupled to the first and second lands; and a package body defining a bottom surface and a side surface, the package body at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in and substantially flush with the bottom surface of the package body, wherein:
the first and second lands are positioned between the die pad and the side surface;the second lands are positioned proximate to the side surface;the first lands are positioned between the die pad and the second lands; andthe first land first recessed top portion of each first land and the second land first bottom recessed portion of each second land are encapsulated by the package body.