发明名称 |
SEMICONDUCTOR DEVICES INCLUDING INSULATING MATERIALS IN FINS |
摘要 |
Semiconductor devices are provided. A semiconductor device includes a first insulating material in a first fin. The semiconductor device includes a second insulating material in a second fin. The first and second insulating materials have different respective sizes. For example, in some embodiments, the first and second insulating materials have different respective widths and/or depths in the first and second fins, respectively. |
申请公布号 |
US2017110456(A1) |
申请公布日期 |
2017.04.20 |
申请号 |
US201615296703 |
申请日期 |
2016.10.18 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Jeon Ho-Jin;Ko Young-Gun;Park Gi-Gwan;Yoo Je-Min |
分类号 |
H01L27/092;H01L29/165;H01L29/78;H01L29/08;H01L29/06;H01L27/02 |
主分类号 |
H01L27/092 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a first substrate region and a second substrate region: a first fin protruding from the first substrate region and comprising a first recess comprising a first cross-sectional area that is defined by a first width and a first depth; a first isolation layer in the first recess; a first source/drain region adjacent at least one side of the first recess and spaced apart from the first isolation layer; a second fin protruding from the second substrate region and comprising a second recess comprising a second cross-sectional area that is defined by a second width and a second depth and is smaller than the first cross-sectional area; a second isolation layer in the second recess; and a second source/drain region adjacent at least one side of the second recess and spaced apart from the second isolation layer. |
地址 |
Suwon-si KR |