| 发明名称 |
LIQUID EJECTING HEAD, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD |
| 摘要 |
A liquid ejecting head includes a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, in which the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction. |
| 申请公布号 |
US2017106653(A1) |
申请公布日期 |
2017.04.20 |
| 申请号 |
US201615295773 |
申请日期 |
2016.10.17 |
| 申请人 |
SEIKO EPSON CORPORATION |
发明人 |
MATSUMOTO Yasuyuki;TANAKA Shuichi;YODA Tsuyoshi;NAKAGAWA Naohiro |
| 分类号 |
B41J2/14;B41J2/16 |
主分类号 |
B41J2/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A liquid ejecting head comprising:
a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, wherein the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, wherein the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and wherein a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction. |
| 地址 |
Tokyo JP |
