Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus

摘要

A semiconductor device has a first semiconductor die including an active region formed on a surface of the first semiconductor die. The active region of the first semiconductor die can include a sensor. An encapsulant is deposited over the first semiconductor die. A conductive layer is formed over the encapsulant and first semiconductor die. An insulating layer can be formed over the first semiconductor die. An opening is formed in the insulating layer over the active region. A transmissive layer is formed over the first semiconductor die including the active region. The transmissive layer includes an optical dielectric material or an optical transparent or translucent material. The active region is responsive to an external stimulus passing through the transmissive layer. A plurality of bumps is formed through the encapsulant and electrically connected to the conductive layer. A second semiconductor die is disposed adjacent to the first semiconductor die.

主权项

1. A method of making a semiconductor device, comprising:
providing a semiconductor die including an active surface comprising a light-sensitive sensor; depositing an encapsulant over the semiconductor die including a first surface of the encapsulant coplanar with the active surface of the semiconductor die; forming a first conductive layer over the active surface of the semiconductor die and the first surface of the encapsulant; forming a transmissive layer over the first conductive layer and light-sensitive sensor; and forming a solder bump through the encapsulant and extending from the first conductive layer to above a second surface of the encapsulant opposite the first conductive layer.