DEFECT OBSERVATION METHOD AND DEVICE AND DEFECT DETECTION DEVICE

摘要

A defect observation method for observing a defect on a sample detected by another inspection device with a scanning electron microscope including the steps of: optically detecting the defect using the position information for the defect: illuminating the sample including the defect with an illumination intensity pattern having periodic intensity variation in two dimensions by irradiating a plurality of illumination light beams onto the surface of the sample while phase modulating the light beams in a single direction and successively moving the light beams in small movements in a direction different from the single direction, imaging the surface of the sample that is illuminated by the illumination intensity pattern having periodic intensity variation in two dimensions and includes the defect detected by the other inspection device, and detecting the defect detected by the other inspection device from the image obtained through the imaging of the surface of the sample.

主权项

1. A defect observation method comprising:
optically detecting a defect on a sample by a detector using position information of the defect on the sample which has been detected by an additional inspection device;correcting the position information of the detected defect; and
observing the defect by a scanning electron microscope using the corrected position information, upon optical detection of the defect using the position information of the defect on the sample, which has been detected by the additional inspection device, the method further including: irradiating the same region on the sample having the defect with dark-field illumination lights from three directions, respectively for interference with one another to generate an interference pattern having periodic intensity variation; executing phase modulation of the interference pattern by slightly shifting an optical path length of the dark-field illumination system; sample scanning by slightly shifting a stage on which the sample is placed, and irradiating the sample surface for illumination of the sample with an illumination intensity pattern having periodic intensity variation in a two-dimensional direction for shifting an imaging position on the detector; and executing a super resolution process by selecting a signal used for the super resolution process from a shift amount derived from the sample scanning.