CERAMIC CARRIER AND SENSOR ELEMENT, HEATING ELEMENT AND SENSOR MODULE, EACH WITH A CERAMIC CARRIER AND METHOD FOR MANUFACTURING A CERAMIC CARRIER

摘要

An Al2O3 carrier has a thin-film structure of platinum or a platinum alloy arranged thereon. The carrier and/or the thin-film structure are adapted to reduce mechanical stresses owing to different thermal expansion coefficients. The carrier and/or the thin-film structure include a surface of the carrier in the region of the thin-film structure is smoothed at least in sections to reduce the adhesion and/or a surface of the carrier has an intermediate layer on which the thin-film structure is arranged. The thermal expansion coefficient of the intermediate layer is from 8*10−6/K to 16*10−6/K, in particular from 8.5*10−6/K to 14*10−6/K, and/or the thin-film structure has at least one conductor path that is undular at least in sections, said conductor path extends laterally along the surface of the carrier.

主权项

1. A ceramic carrier for reducing mechanical stresses, the carrier comprising:
an Al2O3 body; and a thin-film structure comprising platinum or a platinum alloy; wherein a surface of the carrier in a region of the thin-film structure is smoothed at least in portions for reducing an adhesion, or the surface of the carrier has an intermediate layer on which the thin-film structure is arranged, the intermediate layer comprising a coefficient of thermal expansion from 8*10−6/K to 16*10−6K, or the thin-film structure has at least one conductor track, the at least one conductor track being undular at least in portions and extending laterally along the surface of the carrier, wherein the amplitude of the undular conductor track is from 0.2*B to 2*B, and a wavelength of the undular conductor track is from 3*B to 10*B, where “B” is the width of the conductor track, or a first cover layer comprises oxidic nanoparticles of Al2O3 or MgO and is applied directly to the thin-film structure.