发明名称 |
WAFER LEVEL SHIELDING IN MULTI-STACKED FAN OUT PACKAGES AND METHODS OF FORMING SAME |
摘要 |
An embodiment device package includes a device die, a molding compound surrounding the device die, a conductive through inter-via (TIV) extending through the molding compound, and an electromagnetic interference (EMI) shield disposed over and extending along sidewalls of the molding compound. The EMI shield contacts the conductive TIV, and the conductive TIV electrically connects the EMI shield to an external connector. The external connector and the EMI shield are disposed on opposing sides of the device die. |
申请公布号 |
US2017110413(A1) |
申请公布日期 |
2017.04.20 |
申请号 |
US201514918311 |
申请日期 |
2015.10.20 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Chen Wei-Yu;Chen Hsien-Wei;Su An-Jhih;Wang Jo-Mei;Yang Tien-Chung |
分类号 |
H01L23/552;H01L23/48;H01L23/29;H01L25/065;H01L21/78;H01L21/56;H01L21/683;H01L21/3205;H01L25/00;H01L23/31;H01L21/768 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Hsin-Chu TW |