| 摘要 |
An inkjet printing head includes a hydrogen barrier film, covering side surfaces of upper electrodes and piezoelectric films, a portion of an upper surface of each upper electrode, and a portion of an upper surface of a lower electrode, an insulating film, formed above the hydrogen barrier film, upper wiring, formed above the insulating film, connects the upper electrode to a drive circuit, and a lower wiring, formed above the insulating film, connects the lower electrode to the drive circuit. First contact holes, each exposing an upper electrode, and second contact holes, each exposing an extension portion, are formed in the hydrogen barrier film and the insulating film. The upper wirings are connected to the upper surfaces of the upper electrodes via the first contact holes and the lower wiring is connected to an upper surface of the extension portion via the second contact holes. |
| 主权项 |
1. A device using a piezoelectric element comprising: a cavity; a movable film formation layer including a movable film disposed above the cavity and defining a top surface portion of the cavity; and a piezoelectric element formed above the movable film; and wherein the piezoelectric element includes a lower electrode formed above the movable film, a piezoelectric film formed above the lower electrode, and an upper electrode formed above the piezoelectric film, the lower electrode includes a main electrode portion constituting the piezoelectric element and an extension portion led out from the main electrode portion in a direction along a front surface of the movable film formation layer,
the device using the piezoelectric element further comprises: a hydrogen barrier film, covering entireties of side surfaces of the upper electrode and the piezoelectric film, at least a portion of an upper surface of the upper electrode, and at least a portion of an upper surface of the lower electrode; an insulating film, formed above the hydrogen barrier film; an upper wiring, made of gold, formed above the insulating film, and arranged to connect the upper electrode to a drive circuit; and a lower wiring, made of gold, formed above the insulating film, and arranged to connect the lower electrode to the drive circuit; a first contact hole, exposing a portion of the upper electrode, and a second contact hole, exposing a portion of the extension portion, are formed in the hydrogen barrier film and the insulating film, the upper wiring is connected to the upper surface of the upper electrode via the first contact hole, and the lower wiring is connected to the upper surface of the extension portion via the second contact hole. |
