Methods of forming a microshield on standard QFN package

摘要

Shielded electronic packages may have metallic lead frames to connect an electromagnetic shield to ground. In one embodiment, a metallic lead frame of the electronic package and a surface of the metallic lead frame defines a component area for attaching an electronic component. The metallic lead frame includes a metallic structure associated with the component area that may have a grounding element for connecting to ground and one or more signal connection elements, such as signal leads, for transmitting input and output signals. The electromagnetic shield connects to the metallic lead frame to safely connect to ground while maintaining the signal connection elements isolated from the shield.

主权项

1. A method of manufacturing an electronic package, comprising:
providing a metallic lead frame having a component area on a surface of the metallic lead frame and a metallic structure associated with the component area, wherein the metallic structure comprises a plurality of connection portions, each connection portion comprising a plurality of connection leads; providing an electronic component on the component area; providing an overmold within and over the metallic lead frame such that the overmold covers the component area; forming an opening through the overmold that exposes at least a section of the metallic structure; applying an electromagnetic shield material within the opening and over the overmold to form an electromagnetic shield over the component area such that the electromagnetic shield is coupled to at least the section of the metallic structure exposed by the opening; coupling the metallic structure to ground with a grounding portion; partially etching the grounding portion through a first etch; and partially etching the metallic lead frame on a subset of the plurality of connection leads such that remaining ones of the plurality of connection leads other than the subset form grounding leads different from the grounding portion for connection to ground with a second etch.