发明名称 Three dimensional memory arrays and stitching thereof
摘要 The present invention is directed to a memory device including a first layer of memory cells with each cell of the first layer of memory cells including a two-terminal selection element coupled to a memory element in series; a plurality of first local wiring lines connected to one ends of the first layer of memory cells along a first direction with each of the first local wiring lines being electrically connected to two first line selection transistors at two ends thereof; and a plurality of second local wiring lines connected to other ends of the first layer of memory cells along a second direction substantially orthogonal to the first direction with each of the second local wiring lines being electrically connected to two second line selection transistors at two ends thereof.
申请公布号 US9627438(B1) 申请公布日期 2017.04.18
申请号 US201615141726 申请日期 2016.04.28
申请人 Avalanche Technology, Inc. 发明人 Satoh Kimihiro;Yen Bing K.
分类号 H01L47/00;H01L27/22;H01L27/24;H01L45/00 主分类号 H01L47/00
代理机构 代理人 Yen Bing K.
主权项 1. A memory device comprising: a first layer of memory cells, each cell of said first layer of memory cells including a two-terminal selection element coupled to a memory element in series; a plurality of first local wiring lines connected to one ends of said first layer of memory cells along a first direction, each of said first local wiring lines being electrically connected to two first line selection transistors at two ends thereof; and a plurality of second local wiring lines connected to other ends of said first layer of memory cells along a second direction substantially orthogonal to said first direction, each of said second local wiring lines being electrically connected to two second line selection transistors at two ends thereof.
地址 Fremont CA US