发明名称 |
Three dimensional memory arrays and stitching thereof |
摘要 |
The present invention is directed to a memory device including a first layer of memory cells with each cell of the first layer of memory cells including a two-terminal selection element coupled to a memory element in series; a plurality of first local wiring lines connected to one ends of the first layer of memory cells along a first direction with each of the first local wiring lines being electrically connected to two first line selection transistors at two ends thereof; and a plurality of second local wiring lines connected to other ends of the first layer of memory cells along a second direction substantially orthogonal to the first direction with each of the second local wiring lines being electrically connected to two second line selection transistors at two ends thereof. |
申请公布号 |
US9627438(B1) |
申请公布日期 |
2017.04.18 |
申请号 |
US201615141726 |
申请日期 |
2016.04.28 |
申请人 |
Avalanche Technology, Inc. |
发明人 |
Satoh Kimihiro;Yen Bing K. |
分类号 |
H01L47/00;H01L27/22;H01L27/24;H01L45/00 |
主分类号 |
H01L47/00 |
代理机构 |
|
代理人 |
Yen Bing K. |
主权项 |
1. A memory device comprising:
a first layer of memory cells, each cell of said first layer of memory cells including a two-terminal selection element coupled to a memory element in series; a plurality of first local wiring lines connected to one ends of said first layer of memory cells along a first direction, each of said first local wiring lines being electrically connected to two first line selection transistors at two ends thereof; and a plurality of second local wiring lines connected to other ends of said first layer of memory cells along a second direction substantially orthogonal to said first direction, each of said second local wiring lines being electrically connected to two second line selection transistors at two ends thereof. |
地址 |
Fremont CA US |