Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same

摘要

The photosensitive resin composition of the present invention contains a vinyl-based (co)polymer (I) obtained by polymerizing a monomer mixture (α) containing a vinyl-based monomer (a) having a phenolic hydroxyl group, a vinyl-based copolymer (II) having a weight-average molecular weight of 15,000 to 120,000, obtained by polymerizing a monomer mixture (β) containing a vinyl-based monomer (b) represented by CH2═CR1COO(R2O)kR3 (wherein R1=a hydrogen atom or a methyl group, R2=a hydrocarbon group having a carbon number of 1 to 4, R3=a hydrogen atom or a methyl group, and k=1 to 90) and a carboxyl group-containing vinyl-based monomer (c), a photosensitive substance (III), and a compound (IV) which is a specific aromatic polyhydroxy compound.

主权项

1. A photosensitive resin composition comprising:
a vinyl-based (co)polymer (I) obtained by polymerizing a monomer mixture (a) comprising a vinyl-based monomer (a) having a phenolic hydroxyl group and a carboxyl group-containing vinyl-based monomer (c), a vinyl-based copolymer (II) (excluding the vinyl-based (co)polymer (I)) having a weight-average molecular weight of 15,000 to 120,000, obtained by polymerizing a monomer mixture (β) comprising 2-methoxyethyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, styrene, methacrylic acid and ethyl acrylate, a photosensitive substance (III), and a compound (IV) represented by formula (2) shown below: wherein X represents a hydrocarbon group having a carbon number of 1 to 6, each of 1 and m represents an integer of 1 to 3, n represents 1 or 2, and each of p and q represents 0 or 1.