发明名称 Buffer element and manufacturing method thereof, backlight module, and display device
摘要 A buffer element and a manufacturing method thereof, a backlight module, and a display device are disclosed. When the buffer element is applied to the backlight module, the problem caused by thermal expansion of the light guide plate can be effectively solved without needing to reserve a gap in the backlight module, the relative movement of the light guide plate is avoided and the optical quality of the backlight module is improved. The buffer element comprises a buffer body, wherein the buffer body comprises a curable adhesive, and a negative thermal expansion material dispersed in the curable adhesive.
申请公布号 US9625643(B2) 申请公布日期 2017.04.18
申请号 US201414313600 申请日期 2014.06.24
申请人 BOE TECHNOLOGY GROUP CO., LTD.;HEFEI BOE DISPLAY LIGHT CO., LTD. 发明人 Liu Gang
分类号 F21V8/00;C08K11/00;G02F1/1333 主分类号 F21V8/00
代理机构 Kinney & Lange, P.A. 代理人 Kinney & Lange, P.A.
主权项 1. A backlight module, comprising: a back plate; a light guide plate disposed above the back plate, wherein the light guide plate comprises at least one non-light incident side; and a buffer element, wherein: the buffer element is disposed adjacent to the at least one non-light incident side of the light guide plate and is in contact with the at least one non-light incident side of the light guide plate, and the buffer element comprises: a buffer body, wherein the buffer body comprises a curable adhesive, and a negative thermal expansion material dispersed in the curable adhesive such that the buffer element contracts when heated so as to provide a space for the light guide plate to expand therein while the buffer element is in contact with the at least one non-light incident side of the light guide plate.
地址 Beijing CN