发明名称 Deposition of metal doped amorphous carbon film
摘要 Embodiments of the present disclosure relate to a metal-doped amorphous carbon hardmask for etching the underlying layer, layer stack, or structure. In one embodiment, a method of processing a substrate in a processing chamber includes exposing a substrate to a gas mixture comprising a carbon-containing precursor and a metal-containing precursor, reacting the carbon-containing precursor and the metal-containing precursor in the processing chamber to form a metal-doped carbon layer over a surface of the substrate, forming in the metal-doped carbon layer a defined pattern of through openings, and transferring the defined pattern to an underlying layer beneath the metal-doped carbon layer using the metal-doped carbon layer as a mask. An etch hardmask using the inventive metal-doped amorphous carbon film provides reduced compressive stress, high hardness, and therefore higher etch selectivity.
申请公布号 US9624577(B2) 申请公布日期 2017.04.18
申请号 US201514697385 申请日期 2015.04.27
申请人 APPLIED MATERIALS, INC. 发明人 Manna Pramit;Mallick Abhijit Basu;Srinivasan Mukund;Cheng Rui
分类号 C23F1/02;C23C16/26;C23C16/04;C23C16/06;H01J37/32;C23C16/30 主分类号 C23F1/02
代理机构 Patterson + Sheridan, LLP 代理人 Patterson + Sheridan, LLP
主权项 1. A method of processing a substrate in a processing chamber, comprising: exposing a substrate to a gas mixture comprising a hydrocarbon-containing precursor and a metal-containing precursor; thermally reacting the hydrocarbon-containing precursor and the metal-containing precursor in the processing chamber to form a metal-doped amorphous carbon layer over a surface of the substrate; forming in the metal-doped amorphous carbon layer a defined pattern of through openings; and transferring the defined pattern to an underlying layer beneath the metal-doped amorphous carbon layer using the metal-doped amorphous carbon layer as a mask.
地址 Santa Clara CA US