Multi-layer microwave crossover connected by vertical vias having partial arc shapes

摘要

A microwave frequency signal path crossover apparatus for surface mounting to a circuit board. The signal path crossover including interspaced planar horizontal shielding members, horizontal dielectric members, and vertical shielding vias surrounding horizontal signal carrying members connected to the circuit board by vertical vias. Low errant signal emitting structures including partial half and three quarter arc vias, terminating arms, half circle arc transition apertures, via grounding fingers, and compensating capacitive structures are taught.

主权项

1. A signal path crossover apparatus to transfer a signal on a circuit board including a first port, a second port, and a board ground; the signal path crossover comprising:
at least one vertical via; a first conductive layer including a first ground layer electrically connected to the at least one vertical via; a first dielectric layer positioned adjacent to the first conductive layer; a second conductive layer including a signal path connected to the first port and the second part, and a second ground layer electrically connected to the at least one vertical via; a second dielectric layer positioned adjacent to the second conductive layer; a third conductive layer including a third ground layer electrically connected to the at least one vertical via; the at least one vertical via electrically connecting all three of the first ground layer, the second ground layer, and the third ground layer to the board ground, the at least one vertical via including at least one outer corner one quarter arc via, at least one half arc shaped via, and at least one a three quarter arc via positioned adjacent to the first conductive layer.