发明名称 |
Optical sensor having a light emitter and a photodetector assembly directly mounted to a transparent substrate |
摘要 |
An optical sensor is described that includes a light emitter and a photodetector assembly directly attached to a transparent substrate. In one or more implementations, the optical sensor comprises at least one light emitter and a photodetector assembly (e.g., photodiodes, phototransistors, etc.). The light emitter(s) and the photodetector assembly are directly mounted (e.g., attached) to a transparent substrate. |
申请公布号 |
US9627573(B2) |
申请公布日期 |
2017.04.18 |
申请号 |
US201514625753 |
申请日期 |
2015.02.19 |
申请人 |
Maxim Integreated Products, Inc. |
发明人 |
Bhat Jerome C.;Allen Dan G.;Olsen Richard I.;Nagarajan Kumar |
分类号 |
G02B27/00;H01L31/167;H01L31/147 |
主分类号 |
G02B27/00 |
代理机构 |
Advent, LLP |
代理人 |
Advent, LLP |
主权项 |
1. An optical sensor comprising:
a transparent substrate having a surface; at least one light emitter directly mounted to the surface of the transparent substrate, the at least one light emitter configured to emit light; a photodetector assembly directly mounted to the surface of the transparent substrate, the photodetector assembly configured to detect light and provide a signal in response thereto; a polymeric encapsulation structure disposed over the surface of the transparent substrate that at least substantially encapsulates the at least one light emitter and the photodetector assembly, the polymeric encapsulation structure comprising at least one of scattering elements or absorbing elements, the polymeric encapsulation structure having a surface distal to the surface of the transparent substrate; and a plurality of solder bumps disposed over the surface of the transparent substrate, respective solder bumps of the plurality of solder bumps extending beyond a plane that is co-planar with the surface of the polymeric encapsulation structure. |
地址 |
San Jose CA US |