Package-on-package structure having polymer-based material for warpage control

摘要

A package on package structure providing mechanical strength and warpage control includes a first package component coupled to a second package component by a first set of conductive elements. A first polymer-comprising material is arranged between the first package component and the second package component. The first polymer-comprising material surrounds the first set of conductive elements and the second package component. A third package component is coupled to the second package component by a second set of conductive elements. An underfill is arranged on the second package component and surrounds the second set of conductive elements. The first polymer-comprising material extends past sidewalls of the underfill.

主权项

1. A semiconductor device, comprising:
a first package component having an upper surface coupled to a lower surface of a second package component by a first set of conductive elements; a first polymer-comprising material arranged between the first package component and the second package component and surrounding the first set of conductive elements and the second package component; a third package component coupled to the second package component by a second set of conductive elements; an underfill arranged on the second package component and surrounding the second set of conductive elements, wherein the first polymer-comprising material extends past sidewalls of the underfill; and a second polymer-comprising material surrounding the underfill and the third package component, wherein the second polymer-comprising material contacts upper surfaces of the first polymer-comprising material and the second package component, wherein the upper surfaces of the first polymer-comprising material and the second package component face a same direction as the upper surface of the first package component.