Method of manufacturing a semiconductor package

摘要

Methods for a semiconductor device package formed in a chip-on-wafer last process using thin film adhesives are disclosed and may include bonding a first carrier to a first surface of an interposer in wafer form, forming conductive bumps on a second surface of the interposer, bonding a second carrier to the conductive bumps utilizing a film adhesive, removing the first carrier from the interposer, bonding a semiconductor die to the first surface of the interposer, and encapsulating the die and the first surface of the interposer in an encapsulant material. The second carrier and the film adhesive may be removed from the conductive bumps utilizing a slide-off process. The interposer and encapsulant may be diced into a plurality of interposer and die structures. One of the die and interposer structures may be bonded to a substrate. The die may be bonded to the interposer utilizing a mass reflow process.

主权项

1. A method of manufacturing a semiconductor package, the method comprising:
receiving an interposer on a support structure, the interposer comprising an interposer back side that comprises a plurality of interposer back side interconnection structures; attaching a back side carrier to the interposer back side; removing the support structure from the interposer; attaching a semiconductor die to a front side of the interposer; encapsulating at least a portion of the interposer and at least a portion of the semiconductor die in an encapsulating material; and attaching a front side carrier to the encapsulating material and removing the back side carrier.