DBC STRUCTURE USING A SUPPORT INCORPORATING A PHASE CHANGE MATERIAL

摘要

DBC type structure, comprising an insulating support (22) coated with at least one conductive zone (20a) able to receive an electronic device, the conductive zone (20a) being in contact with the support (22), the insulating support incorporating means for thermal smoothing of the heat peak released by the component, these means comprising a cavity filled with a phase change material (FIG. 1).

主权项

1. A manufacturing method for a structure configured to connect and for dissipate the heat produced by an electronic device, the structure comprising: a dielectric support configured to be coated with at least one conductive zone in contact with a first face of the support, the conductive zone being adapted to receive the electronic device, the insulating support being further configured to be coated with at least one other conductive zone in contact with a second face of the support opposed to the first face, the other conductive zone being able to receive a heat exchanger, the insulating support comprising an envelope made of dielectric material forming the outer limits of a cavity filled with a phase change material, the method comprising steps for:
a) forming of an insulating support comprising an envelope of dielectric material defining a cavity, one or more openings being formed in the envelope so as to allow access to the cavity, b) filling the cavity using a phase change material introduced through at least one of said openings.