发明名称 UNIFORMITY CONTROL CIRCUIT FOR USE WITHIN AN IMPEDANCE MATCHING CIRCUIT
摘要 An impedance matching circuit (IMC) is described. The IMC includes a first circuit that includes a first plurality of tuning elements defined along a path. The first circuit has an input coupled to a kilohertz (kHz) radio frequency (RF) generator. The first circuit is coupled to an output. The IMC further includes a second circuit having a second plurality of tuning elements. The second circuit has an input coupled to a megahertz (MHz) RF generator and is coupled to the output. The IMC includes a uniformity control circuit (UCC) defined from at least one of the plurality of tuning elements of the first circuit. The UCC is connected serially along the path of the first circuit to define a capacitance that at least partially influences a radial uniformity profile in an etch rate produced by a plasma chamber.
申请公布号 US2017103870(A1) 申请公布日期 2017.04.13
申请号 US201514878666 申请日期 2015.10.08
申请人 Lam Research Corporation 发明人 Marakhtanov Alexei;Kozakevich Felix;Lucchesi Kenneth;Holland John Patrick
分类号 H01J37/32 主分类号 H01J37/32
代理机构 代理人
主权项 1. An impedance matching circuit comprising: a first circuit including a first plurality of tuning elements defined along a path, the first circuit having an input coupled to a kilohertz (kHz) radio frequency (RF) generator, wherein the first circuit is coupled to an output; a second circuit having a second plurality of tuning elements, wherein the second circuit has an input coupled to a megahertz (MHz) RF generator and is coupled to the output; wherein the output of the first and second circuits is coupled to an input of an RF transmission line that is coupled to an electrode of a plasma chamber used for processing semiconductor substrates, and a uniformity control circuit defined from at least one of the plurality of tuning elements of the first circuit, wherein the uniformity control circuit is connected serially along the path of the first circuit to define a capacitance that at least partially influences a radial uniformity profile in an etch rate produced by the plasma chamber, wherein a change in the capacitance causes an adjustment in the radial uniformity profile, wherein the kHz RF generator is configured to operate in a range of 50 kHz to less than 1000 kHz.
地址 Fremont CA US