发明名称 TRANSISTOR AND METHOD FOR FORMING THE SAME
摘要 The present disclosure provides a method for forming a transistor, including: forming a base structure, containing a first gate structure, an active layer covering the first gate structure, and an insulating structure in the active layer; forming a second gate structure on the active layer; forming a source-drain region, including a source region and a drain region in the active layer each on a different side of the second gate structure; and forming a first interlayer dielectric layer covering the base structure and the second gate structure. The method also includes: forming a first contact hole that exposes the first gate structure by etching the first interlayer dielectric layer and the insulating structure; and forming a second contact hole that exposes the second gate structure and a third contact hole that exposes the drain region by etching the first interlayer dielectric layer.
申请公布号 US2017104084(A1) 申请公布日期 2017.04.13
申请号 US201615280214 申请日期 2016.09.29
申请人 Semiconductor Manufacturing International (Beijing) Corporation ;Semiconductor Manufacturing International (Shanghai) Corporation 发明人 HUANG HERB HE;DROWLEY CLIFFORD IAN;LI HAI TING;ZHU JI GUANG
分类号 H01L29/66;H01L21/311;H01L21/306;H01L29/786;H01L21/762 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method for forming a transistor, comprising: forming a base structure, containing a first gate structure, an active layer covering the first gate structure, and an insulating structure in the active layer; forming a second gate structure on the active layer; forming a source-drain region, including a source region and a drain region in the active layer each on a different side of the second gate structure; forming a first interlayer dielectric layer covering the base structure and the second gate structure; forming a first contact hole that exposes the first gate structure by etching the first interlayer dielectric layer and the insulating structure; forming a second contact hole that exposes the second gate structure and a third contact hole that exposes the drain region by etching the first interlayer dielectric layer; and filling the first contact hole, the second contact hole, and the third contact hole with a conductive material to form a first plug structure, a second plug structure, and a third plug structure, that are aligned along a substantially same direction.
地址 Beijing CN