WIRING SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A wiring substrate used for improvement in manufacturing efficiency of a semiconductor device includes a support body having transparency; an adhesive layer disposed on a main surface of the support body, the adhesive layer including a peeling layer which contains a third resin which is decomposed by light irradiation and a protective layer which is disposed on the peeling layer and contains a fourth resin; and a laminate disposed on the adhesive layer, the laminate including a first resin layer, a second resin layer disposed on the first resin layer, and a wiring pattern disposed at least between the first resin layer and the second resin layer. Accordingly, the semiconductor chip and the wiring substrate which is the external connection member can be separately manufactured, thereby improving manufacturing efficiency of the semiconductor device.

主权项

1. A wiring substrate comprising:
a support body having transparency; an adhesive layer disposed on a main surface of the support body; and a laminate disposed on the adhesive layer, the laminate including a first resin layer, a second resin layer disposed on the first resin layer, and a wiring pattern disposed at least between the first resin layer and the second resin layer, wherein the adhesive layer includes a peeling layer which is disposed on the main surface of the support body and contains a third resin which is decomposed by light irradiation, and a protective layer which is disposed on the peeling layer so as to protect the laminate from the light and contains a fourth resin.