发明名称 Epitaxy Technique for Growing Semiconductor Compounds
摘要 A solution for fabricating a semiconductor structure is provided. The semiconductor structure includes a plurality of semiconductor layers grown over a substrate using a set of epitaxial growth periods. During each epitaxial growth period, a first semiconductor layer having one of: a tensile stress or a compressive stress is grown followed by growth of a second semiconductor layer having the other of: the tensile stress or the compressive stress directly on the first semiconductor layer.
申请公布号 US2017104132(A1) 申请公布日期 2017.04.13
申请号 US201615391922 申请日期 2016.12.28
申请人 Sensor Electronic Technology, Inc. 发明人 Jain Rakesh;Sun Wenhong;Yang Jinwei;Shatalov Maxim S.;Dobrinsky Alexander;Gaska Remigijus;Shur Michael
分类号 H01L33/32;H01L33/12;H01L33/06;H01L33/00 主分类号 H01L33/32
代理机构 代理人
主权项 1. A semiconductor heterostructure comprising: a plurality of semiconductor layers epitaxially grown over a substrate, the plurality of semiconductor layers including a set of periods, each period including: a first semiconductor layer, wherein the first semiconductor layer is grown using a first molar ratio of group V precursors to group III precursors (first V/III ratio) causing a first stress being one of: a tensile stress or a compressive stress; anda second semiconductor layer located over the first semiconductor layer, wherein the second semiconductor layer is grown using a second molar ratio of group V precursors to group III precursors (second V/III ratio) causing a second stress being the other of: the tensile stress or the compressive stress, wherein at least one of the first stress or the second stress is graded.
地址 Columbia SC US