| 发明名称 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | ||
| 摘要 | A method of manufacturing an electronic device may include: forming at least one electronic component in a substrate; forming a contact pad in electrical contact with the at least one electronic component; wherein forming the contact pad includes: forming a first layer over the substrate; planarizing the first layer to form a planarized surface of the first layer; and forming a second layer over the planarized surface, wherein the second layer has a lower porosity than the first layer. | ||
| 申请公布号 | US9620466(B1) | 申请公布日期 | 2017.04.11 |
| 申请号 | US201514953456 | 申请日期 | 2015.11.30 |
| 申请人 | INFINEON TECHNOLOGIES AG | 发明人 | Mischitz Martin;Heinrici Markus;Eichinger Barbara;Schneegans Manfred;Krivec Stefan |
| 分类号 | H01L21/00;H01L23/00;H01L21/02;H01L23/532 | 主分类号 | H01L21/00 |
| 代理机构 | Viering, Jentschura & Partner mbB | 代理人 | Viering, Jentschura & Partner mbB |
| 主权项 | 1. A method of manufacturing an electronic device, the method comprising: forming at least one electronic component in a substrate; forming a contact pad in electrical contact with the at least one electronic component; wherein forming the contact pad comprises: forming a first layer over the substrate;planarizing the first layer to form a planarized surface of the first layer; andforming a second layer over the planarized surface, wherein the second layer has a lower porosity than the first layer. | ||
| 地址 | Neubiberg DE | ||