| 发明名称 |
Power module packaging with dual side cooling |
| 摘要 |
A multichip package includes a first semiconductor device mounted on a first leadframe, in which a primary heat producing surface of the first semiconductor device is oriented towards and in contact with a heat dispersing region of the first leadframe. A second semiconductor device is mounted on a second leadframe, in which a primary heat producing surface of the second semiconductor device is oriented towards and in contact with a heat dispersing region of the second leadframe. A surface of the heat dispersing region of the first leadframe is exposed on a first side of the multichip package, and a surface of the heat dispersing region of the second leadframe is exposed on a second side of the multichip package that is opposite from the first side. |
| 申请公布号 |
US9620440(B1) |
申请公布日期 |
2017.04.11 |
| 申请号 |
US201615054117 |
申请日期 |
2016.02.25 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Shibuya Makoto |
| 分类号 |
G01K7/01;H01L23/495;H01L25/065;H01L23/31;H01L23/367;H01L21/48;H01L21/56;H01L23/00;H01L25/00 |
主分类号 |
G01K7/01 |
| 代理机构 |
|
代理人 |
Keagy Rose Alyssa;Brill Charles A.;Cimino Frank D. |
| 主权项 |
1. A multichip package comprising:
a first semiconductor device mounted on a first leadframe, in which a primary heat producing surface of the first semiconductor device is oriented towards and in contact with a heat dispersing region of the first leadframe; a second semiconductor device mounted on a second leadframe, in which a primary heat producing surface of the second semiconductor device is oriented towards and in contact with a heat dispersing region of the second leadframe; in which the first leadframe is a coplanar etched leadframe with protruding contact regions, and the second leadframe is a coplanar etched leadframe with protruding contact regions in contact with corresponding protruding contact regions on the first leadframe; and in which a surface of the heat dispersing region of the first leadframe is exposed on a first side of the multichip package, and a surface of the heat dispersing region of the second leadframe is exposed on a second side of the multichip package that is opposite from the first side. |
| 地址 |
Dallas TX US |
