Elastic wave device with a bump defining a shield and manufacturing method thereof

摘要

In an elastic wave device, a first electrode structure and a second electrode structure are provided on a piezoelectric substrate, first and second elastic wave element portions are configured by the first electrode structure and the second electrode structure, respectively, and a first bump that is configured of a conductive material to provide shielding is provided on an electrode formation surface of the piezoelectric substrate between the first elastic wave element portion and the second elastic wave element portion.

主权项

1. An elastic wave device comprising:
a piezoelectric substrate; a first electrode structure provided on the piezoelectric substrate and defining a first elastic wave element portion; a second electrode structure provided on the piezoelectric substrate and defining a second elastic wave element portion; a first bump provided on the piezoelectric substrate between the first elastic wave element portion and the second elastic wave element portion, and configured of a conductive material to define a shield; and a second bump electrically connected to the first electrode structure or the second electrode structure to provide an electrical connection to an exterior; wherein a height of the first bump is lower than a height of the second bump.