Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

摘要

Provided are a hybrid substrate, a semiconductor package including the same, and a method for fabricating the semiconductor package. The hybrid substrate may include an insulation layer, and an organic layer. The insulation layer may include a top, a bottom opposite to the top, and a conductive pattern having different pitches. The organic layer may be connected to the bottom of the insulation layer, and may include a circuit pattern connected to the conductive pattern. The conductive pattern may include a first metal pattern, and a second conductive pattern. The first metal pattern may have a first pitch, and may be disposed in the top of the insulation layer. The second conductive pattern may have a second pitch greater than the first pitch, and may be extended from the first metal pattern to be connected to the circuit pattern through the insulation layer.

主权项

1. A semiconductor package including a plurality of external terminals, the semiconductor package comprising:
a semiconductor chip including a plurality of chip pads, the chip pads having a first pitch; a first layer on the semiconductor chip, the first layer formed of a first organic material, the first layer including,
a plurality of first conductive patterns on a bottom surface of the first layer, the first conductive patterns having a second pitch, the first conductive patterns connected to the chip pads,a plurality of second conductive patterns on a top surface of the first layer, the second conductive patterns having a third pitch, the third pitch being greater than the first pitch, anda plurality of circuit patterns connecting the first conductive patterns with the second conductive patterns; a second layer on the first layer, the second layer formed of a second organic material different from the first organic material, the second layer including,
a plurality of first vias penetrating the second layer, anda plurality of third conductive patterns on a top surface of the second layer, the first was connecting the second conductive patterns with the third conductive patterns; and a third layer on the second layer, the third layer formed of the second organic material, the third layer including,
a plurality of second vias penetrating the third layer, the second vias connecting the third conductive patterns with the external terminals.