| 摘要 |
Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer. |
| 主权项 |
1. A method of manufacturing a surface-mountable polymer PTC device (130), comprising:
(a) forming a matrix of surface-mountable electronic devices by: (i) laminating an active polymer layer (132) between first and second metal foil layers; (ii) removing a portion of the first foil layer to form an array of first electrodes (134) and removing a portion of the second foil layer to form an array of second electrodes (136); (iii) applying a first insulation layer (142) and a second insulation layer (144) on the array of first and second electrodes (134, 136), respectively; (iv) applying a first metallization layer on the first insulation layer (142); (v) applying a second metallization layer on the second insulation layer (144); (vi) forming a first array of metallized vias (152), each having metallization connecting one of the second electrodes (136) and the first and second metallization layers, each of the first array of metallized vias being isolated from one of the first electrodes (134) by a portion (138) of the first insulation layer (142); and forming a second array of metallized vias (154), each having metallization connecting one of the first electrodes (134) to the first and second metallization layers, each of the second array of metallized vias being isolated from one of the second electrodes (136) by a portion (140) of the second insulation layer (144); (vii) removing part of the second metallization layer to form an array of first surface mount terminals (146) each physically connected to the first array of metallized vias (152) and a second array of surface mount terminals (148) each physically connected to the second array of metallized vias (154), each of the first surface mount terminals being electrically connected by one of the first array of metallized vias (152) to the second electrode (136) and isolated by a portion (138) of the first insulation layer (142) from the first electrode (134) and each of the second surface mount terminals being electrically connected by one of the second array of metallized vias (154) to the first electrode (134) and isolated by a portion (140) of the second insulation layer (144) from the second electrode (136); wherein the portion (138) of the first insulation layer (142) separating the first array of metallized vias (152) from the first electrode (134) comprises a first isolation area, and the portion (140) of the second insulation layer (144) separating the second array of metallized vias (154) from the second electrode (136) comprises a second isolation area; and wherein the first isolation area is configured as a first lateral band spaced from the first array of metallized vias (152) by a first metal area (139), and the second isolation area is configured as a second lateral band spaced from the second array of metallized vias (154) by a second metal area (141); and removing at least a portion of the first metallization layer adjacent to each of the first and second arrays of metallized vias (152, 154); and (b) singulating the matrix into a plurality of individual surface-mountable electronic devices (130), each of the devices including a first cross-conductor (156) defined by one of the metallized vias (152) in the first array of metallized vias, a second cross-conductor (158) defined by one of the metallized vias (154) in the second array of metallized vias, a first surface mount terminal (146) in physical contact with the first cross-conductor (156), and a second surface mount terminal (148) in physical contact with the second cross-conductor (158);
wherein each of the first cross-conductors (156) is in physical contact with one of the second electrodes (136) and is isolated from one of the first electrodes (134) by the portion (138) of the first insulation layer (142) configured as a first lateral band spaced from the first cross-conductors (156) by a first metal area (139), and wherein each of the second cross-conductors (158) is in physical contact with one of the first electrodes (134) and is isolated from one of the second electrodes (136) by the portion (140) of the second insulation layer (144) configured as a second lateral band spaced from the second cross-conductors (158) by a second metal area (141). |
