Thermoelectric Generator To Engine Exhaust Manifold Interface Using A Direct-Bond-Copper (DBC) Arrangement

摘要

An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold includes a first heat-exchanger, a first dielectric-layer, a TEG, and a direct-bond-copper-arrangement (DBC). The first dielectric-layer overlies a portion of the outer surface of the first heat-exchanger. The first dielectric-layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat-exchanger. The TEG defines a first contact suitable to be coupled thermally and electrically to the first conductor-layer. The DBC is interposed between the first dielectric-layer and the first contact of the TEG. The DBC is formed by an adhesion-layer formed of high-adhesion-copper-thick-film in contact with the first dielectric-layer, a bond-layer formed of copper-thick-film that overlies and is in contact with the adhesion-layer opposite the first-dielectric-layer, and a copper-foil-layer that overlies and is in contact with the bond-layer opposite the adhesion-layer.

主权项

1. An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine, said assembly comprising:
a first heat-exchanger suitable to couple thermally heat from an exhaust gas of an internal combustion engine within the first heat-exchanger to an outer surface of the first heat-exchanger, wherein the outer surface is formed of stainless steel; a first dielectric-layer that overlies a portion of the outer surface of the first heat-exchanger, said first dielectric-layer formed by firing a thick-film dielectric material onto the stainless steel of the first heat-exchanger; a TEG that defines a first contact suitable to be coupled thermally and electrically to the first conductor-layer; and a direct-bond-copper-arrangement (DBC) interposed between the first dielectric-layer and the first contact of the TEG, wherein the DBC is formed by an adhesion-layer formed of high-adhesion-copper-thick-film in contact with the first dielectric-layer, a bond-layer formed of copper-thick-film that overlies and is in contact with the adhesion-layer opposite the first-dielectric-layer, and a copper-foil-layer that overlies and is in contact with the bond-layer opposite the adhesion-layer.